Detection of defects in semiconductor wafers, devices and related products is very subjective and varies from company to company. We have developed a modular system that allows you to decide what you have as a “pass-fail” criteria and how you want to implement those results.
Integration is key: We understand that in most cases there is an existing workflow and data stream that needs to be maintained so our systems has been designed to integrate into company with a the minimum of effort.
Some of things we are asked to find….
- Particles to Gross scratches (size, placement etc. )
- Staining, mis-processing
- Mis-algnment of layers
- Bond Pad and Probe Mark issues (too large, missing, wrong place etc..)
- Continuity of edges and block areas+ Much more – just ask!Unfortunately we are covered by lots of NDA’s (Non Disclosure Agreements) so we can only show you results on your own samples.
(Which is why there are only a few images on this site… sorry)